Most Read Articles – TI Analogue, Intel Grants, Nasa Spacesuits

What topics are covered this week? There’s Texas Instruments retaining its position in analog, Intel receiving German manufacturing grants, Nasa awarding contracts to build spacesuits, a hybrid direct-link self-assembly process for D2W linking and Sony’s new space communications company…

5. Sony launches laser-based Space Communications Corporation
Sony America, has officially formed a new company – Sony Space Communications Corporation (“SSC”) – to better enable optical space communications for microsatellites. The problem the company is tackling is that while the amount of data used in orbit increases every year (with ever more satellites in space), the amount of radio waves available is limited. Specifically, the company plans to develop small optical communication devices to connect microsatellites in LEO (Low Earth Orbit) through the use of laser beams.

4. Intel and CEA-Leti Accelerate D2W Link
Intel and CEA-Leti have optimized a direct bond self-assembly hybrid process for Die-to-Wafer (D2W) bonding that has the potential to increase alignment accuracy as well as manufacturing throughput of multiple thousands of dies per hour. The approach uses the capillary forces of a water droplet to align the dies to a target wafer.

3. NASA prepares next-generation spacesuits for extravehicular activity services
NASA has chosen two companies to build its next-generation astronaut spacesuits: Axiom Space and Collins Aerospace. The spacesuits will have to support spacewalks in low Earth orbit outside the ISS and also on the Moon as part of future Artemis missions. How much do the costumes cost? Extravehicular Activity Services (xEVAS) contracts have a potential total value of $3.5 billion over the lifetime of the program. Under the terms of the contract, the companies will compete for mission orders for missions taking place until 2034.

2. Intel to get German grants worth $7.3 billion
Intel will receive $7.3 billion in grants representing 40% of the $19 billion cost of building two factories in Magdeburg, Germany. Construction is expected to begin next year with the first silicon slated for 2027. Intel is also building two factories in Chandler, Arizona at a cost of $20 billion and plans to build two factories in Columbus, Ohio, to a cost of 20 billion dollars.

Negative resistance response EinW TI1. TI reigns supreme over analog
TI firmly maintains its position as the top analog player as the top ten players account for 68% of industry revenue, IC Insights’ Q2 update reports in its McLean report. With analog sales up 29% from 2020 to $14.1 billion and holding a 19% market share, TI firmly maintained its No. 1 position in analog last year, increasing its sales of $3.2 billion from 2020. TI’s analog revenues in 2021 accounted for 86% of its $16.3 billion in IC sales and 81% of its $17.3 billion in semiconductor revenues.

Amanda J. Marsh