Most Read Articles – Infineon, SiC and GaN Bond, Arizona Plant
What are the topics covered? There’s Infineon selling a corporate bond worth €500 million and also investing €2 billion to manufacture SiC and GaN power ICs, China’s share of global wafer capacity and the delay in the construction of the TSMC factory in Arizona…
5. China owns 16% of global wafer capacity
The new 2022 edition of Global Wafer Capacity shows that China holds 16% of global IC wafer manufacturing capacity, according to Knometa Research. Global IC wafer capacity at the end of 2021 was 21.6 million 200mm equivalent wafers per month, with factories in China having the capacity to process 3.5 million. China’s capacity share has increased by one percentage point in each of the past two years and by a total of seven points since 2011, when the country accounted for just 9% of all IC wafer capacity.
4. Infineon will invest 2 billion euros in SiC and GaN
Infineon will invest more than 2 billion euros in the construction of a third module at its manufacturing site in Kulim, Malaysia, to manufacture SiC and GaN power integrated circuits. The third module will generate more than >2 billion in annual revenue. The expansion will benefit from the economies of scale already realized for the manufacture of 200 millimeters in Kulim. It will complement Infineon’s leadership position in silicon, based on 300 millimeter manufacturing in Villach and Dresden.
3. WDC/Kioxia Factory Contamination Could Drive Q2 NAND Price Surge
The second-quarter flash price could jump 5-10% due to contamination at Western Digital/Kioxia’s Yokkaichi and Kitakami factories, according to TrendForce. The contaminated products in this incident are concentrated in 3D NAND (BICS) with an initial estimate of 6.5 exabytes (approximately 6,500 MB of GB) affected. According to TrendForce, damaged bits represent 13% of the group’s production in 1Q22 and approximately 3% of the total production for the year.
2. TSMC’s Arizona factory delayed
The construction of the TSMC factory in Arizona is taking longer than expected. TSMC originally planned to start moving the equipment into the factory by September this year, but the company reportedly told suppliers that the deadline would be pushed back to February or March 2023. The TSMC project was announced in May 2020 and construction started last. June. In Taiwan, TSMC typically reaches the equipment move phase in about 15 months, and sometimes 12 months.
1. Infineon raises 500 million euros by selling bonds
Infineon has sold a corporate bond worth €500 million under its European Medium Term Notes (EMTN) program. The site was oversubscribed several times. The money raised will be used to repay the bank loans taken out to buy Cypress Semiconductor. In June 2020, Infineon placed corporate bonds worth €2.9 billion in its EMTN program.